▎ 摘　　要

NOVELTY - Method for forming a lamination stack, involves (a) providing a core, (b) applying an adhesive layer to a top surface of the core, and (c) attaching a graphene-metal structure to a top surface of the core via the adhesive layer, where the graphene-metal structure comprises a metal layer and a graphene layer on at least one of a top surface of the metal layer or a bottom surface of the metal layer. USE - The method is useful for forming a lamination stack. ADVANTAGE - The method promotes higher frequency performance of printed circuit boards, and has excellent heat management of printed circuit boards, higher thermal conductivity of printed circuit boards, and higher electron mobility within printed circuit boards. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a lamination stack comprising a core, an adhesive layer applied to a top surface of the core, and a graphene-metal structure attached to a top surface of the core via the adhesive layer, where the graphene-metal structure comprises a metal layer and a graphene layer on at least one of a top surface of the metal layer or a bottom surface of the metal layer.