• 专利标题:   Preparation of graphene-reinforced copper matrix composite involves adding three-dimensional copper-deposited graphene/copper foam and copper powder into graphite die, sintering and water cooling.
  • 专利号:   CN105386003-A, CN105386003-B
  • 发明人:   CHEN S, FENG J, LIN J, LUO D, QI J, WANG Z
  • 专利权人:   HARBIN INST TECHNOLOGY, HARBIN INST TECHNOLOGY
  • 国际专利分类:   B22F003/105, C23C014/18, C23C014/24, C23C016/26
  • 专利详细信息:   CN105386003-A 09 Mar 2016 C23C-016/26 201649 Pages: 8 English
  • 申请详细信息:   CN105386003-A CN10874598 02 Dec 2015
  • 优先权号:   CN10874598

▎ 摘  要

NOVELTY - Preparation of graphene-reinforced copper matrix composite involves placing pre-treated copper foam in a chemical vapor deposition apparatus, introducing hydrogen gas, annealing, depositing at 800-100 degrees C for 5-60 minutes, obtaining graphene/copper foam composite, placing the resultant composite in a vacuum coating apparatus, depositing at 100-120 A for 1-60 seconds, obtaining copper-deposited graphene/copper foam, adding three-dimensional copper-deposited graphene/copper foam and copper powder into a graphite die, sintering and water cooling. USE - Preparation of graphene-reinforced copper matrix composite (claimed). ADVANTAGE - The method provides graphene-reinforced copper matrix composite having excellent thermal conductivity. DETAILED DESCRIPTION - Preparation of graphene-reinforced copper matrix composite involves pre-treating copper foam using acetone, placing pre-treated copper foam in a chemical vapor deposition apparatus, introducing hydrogen gas in flow rate of 2-20 sccm at hydrogen pressure of 105 Pa, annealing at 800-1000 degrees C for 10-30 minutes in methane gas flow rate of 10-100 sccm, depositing at 800-100 degrees C and pressure of 105 Pa for 5-60 minutes, terminating introduction of methane gas, cooling to room temperature, obtaining graphene/copper foam composite, placing the resultant composite in a vacuum coating apparatus, vacuumizing to 5x 10-4 Pa or less, depositing at 100-120 A for 1-60 seconds, obtaining copper-deposited graphene/copper foam, adding the copper-deposited graphene/copper foam and copper powder in molar ratio of 1:(10-20), into a graphite die, increasing the temperature at 50-100 degrees C/minute, sintering at 800-1000 degrees C and 20-50 MPa for 1-5 minutes in a closed spark plasma sintering equipment, water cooling and obtaining three-dimensional structured-graphene-reinforced copper matrix composite.