▎ 摘　　要

NOVELTY - Transferring a two-dimensional material to hole substrate involves: (1) adhering polydimethylsiloxane (PDMS) film on a glass slide; (2) stripping two-dimensional material block to be transferred to the PDMS film obtained in step (1) by mechanical stripping method; (3) finding the two-dimensional material after stripping under a microscope, and cutting off the excess PDMS film; (4) fixing the glass slide with the material obtained in step (3) in a substrate card slot of a two-dimensional material transfer table; (5) adsorbing a silicon substrate with holes on a sample holder of a transfer stage; (6) aligning the material obtained in step (4) with the hole on the silicon substrate, and heating the PDMS film to partially contact the silicon substrate; (7) continuously heating, so that the PDMS film spontaneously adheres closely to the silicon substrate; and (8) cooling to separate the PDMS film from the silicon substrate. USE - The method is useful for transferring two-dimensional material to hole substrate used in photoelectric, electron and thermology applications. ADVANTAGE - The method: transfers the two-dimensional materials to the silicon substrates with holes by adjusting the viscosity of PDMS films by changing the temperature; cleans the surface of the transferred sample for pure dry transfer; is simple in operation, and not necessary to implement the temperature control of the PDMS film besides the transfer table by using too many experimental instruments; and solves the low dry transfer success rate caused by weak adhesion of the material to the substrate.