▎ 摘　　要

NOVELTY - A low-viscosity low-temperature-resistant sealant comprises 100 parts mass epoxy resin, 10-15 parts mass toughening modifier, 20-40 parts mass reaction curing agent, 0.5-3 parts mass silane coupling agent, 0.05-0.3 part mass single-layer graphene oxide and 5-10 parts mass acetone. USE - Low-viscosity low-temperature-resistant sealant used in chip package for mounting semiconductor integrated circuit chip. ADVANTAGE - The method modifies the epoxy resin with polyurethane, improves the toughness of the glue after curing, and avoids brittle cracks in a low-temperature environment, which leads to the exposure of internal metals to form a short circuit, after diluting with acetone, the initial viscosity of the glue is low and has excellent fluidity, with continuous volatilization of acetone, increases the viscosity of the glue, reduces the fluidity and avoids the phenomenon of glue leaking outward, adding single layer graphene oxide, shields the electromagnetic field and avoids the interference of the external electromagnetic field on the chip signal, addition of coupling agent promotes degassing, improves the adhesion to metal, avoids forming holes in the chip, adding silane coupling agent makes the glue have a preset ability to resist water vapor, and avoids water vapor in the external environment. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of low-viscosity low-temperature-resistant sealant, which involves (S1) heating and vacuum dehydrating epoxy resin, adding toughening modifier for reaction, adding acetone, stirring and diluting for 1-3 hours to prepare glue (A), (S2) adding silane coupling agent into reaction curing agent, adding single-layer graphene oxide, defoaming agent and molecular sieve, and uniformly dispersing using high-speed shearing machine to form glue (B), and (S3) mixing glue (A) and glue (B), defoaming using defoaming machine, dispensing the chip using dispenser, and curing after dispensing.