• 专利标题:   Bonding wire, has coating layer coated with copper, and wire body provided with copper alloy, graphene wire, diamond, carbon and carbon nanotube, where coating layer is monolayer and thickness of coating layer is in specific mm.
  • 专利号:   WO2013032175-A2, WO2013032175-A3, KR2013025646-A, WO2013032175-A4, KR1829907-B1
  • 发明人:   KIM J, CHA H, KWAK I, CHA H J, KIM J I, KWAK I J
  • 专利权人:   LG CABLE LTD, LS CABLE SYSTEM LTD, LS CABLE SYSTEM LTD
  • 国际专利分类:   H01L021/60
  • 专利详细信息:   WO2013032175-A2 07 Mar 2013 H01L-021/60 201319 Pages: 11
  • 申请详细信息:   WO2013032175-A2 WOKR006721 23 Aug 2012
  • 优先权号:   KR089078

▎ 摘  要

NOVELTY - The wire (30) has a coating layer coated with copper. A wire body is provided with a copper alloy, a graphene wire, a diamond, carbon and carbon nanotube. The coating layer is a monolayer. Thickness of the coating layer is 0.35 ~ 200 nm. Thickness of a hetero-metal is 0.1 ~ 0.7 micron. The wire body is coated with a carbon allotrope. A capillary unit (70) is fixed in the wire body. A free air ball (90) is formed in a side end part of the wire body. USE - Bonding wire. ADVANTAGE - The wire improves conductivity process and productivity. The wire reduces manufacturing cost. The wire reduces weight of wire cross sections. The wire ensures better anti-oxidation effect and workability. DESCRIPTION OF DRAWING(S) - The drawing shows a side view of a bonding wire. Wire (30) Capillary unit (70) Free air ball (90)