• 专利标题:   Thin-film structure used in semiconductor element, comprises substrate, nanocrystalline graphene layer on substrate, and two-dimensional material layer on nanocrystalline graphene layer, where substrate is silicon, silicon dioxide, aluminum oxide, quartz, germanium, gallium nitride, aluminum nitride.
  • 专利号:   US2022302319-A1, KR2022130448-A
  • 发明人:   CHO Y, LEE Z, SHIN H, SONG S, SON S, KIM J, KWON S, LEE C, LEE C S, YONG K S, KIM J H, SONG S U, SHIN H J, YI J H, CHO Y C
  • 专利权人:   UNIST ULSAN NAT SCI TECHNOLOGY INST, SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD, UNIST ULSAN NAT SCI TECHNOLOGY INST
  • 国际专利分类:   H01L029/06, H01L029/16, H01L029/66, H01L029/786, H01L021/02, H01L029/417, H01L029/872
  • 专利详细信息:   US2022302319-A1 22 Sep 2022 H01L-029/786 202284 English
  • 申请详细信息:   US2022302319-A1 US495457 06 Oct 2021
  • 优先权号:   KR035348

▎ 摘  要

NOVELTY - Thin-film structure comprises a substrate, a nanocrystalline graphene layer (10) on the substrate, and a two-dimensional material layer (20) on the nanocrystalline graphene layer. The nucleation density of the two-dimensional material layer is 109 ea/cm2 or more with specific nanocrystalline graphene layer. USE - Thin-film structure used in semiconductor element (claimed). ADVANTAGE - The thin-film structure has excellent mechanical, thermal, and electrical property, increased nucleation density of a two-dimensional material layer, and greatly decreased manufacturing time. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: 1. a semiconductor element, which comprises: a thin-film structure including a nanocrystalline graphene layer and a two-dimensional material layer on the nanocrystalline graphene layer; and 2. a method of manufacturing a thin-film structure, which involves: forming a nanocrystalline graphene layer on a substrate in a reaction chamber; and forming a two-dimensional material layer on the nanocrystalline graphene layer.