▎ 摘　　要

NOVELTY - The light emitting device has an interfacial layer (210) that is arranged between the package substrates. The interfacial layer includes a silicone resin, in which the graphene is dispersed. A fillet layer (220) extended to the side of a light-emitting device chip (110). USE - Light emitting device for use in a light source of a backlight unit of a display product. ADVANTAGE - The interfacial layer includes a silicone resin, in which the graphene is dispersed and the fillet layer extended to the side of a light-emitting device chip, thus improves thermal conductivity and reduces light loss about the light emitted to the outside. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a manufacturing method of a heat radiation composition. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a light emitting device. (Drawing includes non-English language text). Light-emitting device chip (110) Lead frame (122) Interfacial layer (210) Fillet layer (220)