▎ 摘　　要

NOVELTY - Forming patterned layer of material involves providing a substrate having a layered structure, where the layered structure comprises a base layer, a support layer, and a thermally insulating layer. The thermally insulating layer has a lower thermal conductivity than the support layer, where the support layer comprises multiple sub-units that are thermally insulated from each other within a plane of the support layer. The selected portion of the support layer is selectively irradiated during a deposition process, where the irradiation locally drives the deposition process in the selected portion to form a layer of deposited material in a pattern defined by the selected portion. USE - Method for forming patterned layer of material. ADVANTAGE - The method forms the patterned layer of material in a simple, cost-effective and eco-friendly manner with improved heat retention in the support layer, and reduced rate of heat conduction away from the selected portion. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for forming a semiconductor device, which involves forming layer in the device.