▎ 摘　　要

NOVELTY - The semiconductor package device has: a redistribution layer (10) comprising a first surface defining an opening, a second surface opposite to the first surface, and a circuit layer (10A); a thermal conductor (12) disposed in the opening; an electronic device (16A) disposed on the first surface of the redistribution layer above the thermal conductor; an electronic component (18) disposed on the first surface of the redistribution layer; a molding layer (14) formed on the first surface, surrounding the electronic device and covering the electronic component; and a solder ball (19) disposed on the second surface of the redistribution layer and electrically connected to the circuit layer. The material of the thermal conductor is copper, copper alloy, ceramic, graphene, graphite, carbon nanotube, or carbon nanospheres. USE - Semiconductor package device. ADVANTAGE - The heat dissipation efficiency of the semiconductor package device is improved by the thermal conductor. The thermal energy generated by the electronic device is quickly dissipated through the thermal conductor. In addition, the stresses on the thermal conductor are higher than those on the redistribution layer . The redistribution layer embedded with the thermal conductor prevents the redistribution layer from cracking, thus improving the reliability of the semiconductor products. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method of manufacturing the semiconductor package device. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic cross-sectional diagram of a semiconductor package device. 10Redistribution layer 10ACircuit layer 12Thermal conductor 14Molding layer 16AElectronic device 18Electronic components 19Solder balls