▎ 摘　　要

NOVELTY - Preparing conductive wire core involves preparing plating solution by mixing 100-120 g/L copper sulfate, 26-45 g/L sulfuric acid, 0.06-0.09 g/L chloride ion, 3.5-4.5 g/L surfactant, 6-8 g/L nano-graphene and 0.001-0.005 g/L nano activated carbon and ultrasonically treating for 10 mins at a frequency of 40-50 kilohertz and at a temperature of 70-88 degrees C. The copper sheet is taken as anode, copper is taken as cathode and placed in a plating solution, heated for 0.5-1 hour at 30-80 degrees C, then lowered the temperature to 50 degrees C, while keeping it for 1-2 hour. USE - Method for preparing conductive wire core (claimed). ADVANTAGE - The method enables to prepare conductive wire core, that has good conductivity and corrosion resistance. DETAILED DESCRIPTION - Preparing conductive wire core involves preparing plating solution by mixing 100-120 g/L copper sulfate, 26-45 g/L sulfuric acid, 0.06-0.09 g/L chloride ion, 3.5-4.5 g/L surfactant, 6-8 g/L nano-graphene and 0.001-0.005 g/L nano activated carbon and ultrasonically treating for 10 mins at a frequency of 40-50 kilohertz and at a temperature of 70-88 degrees C. The copper sheet is taken as anode, copper is taken as cathode and placed in a plating solution, heated for 0.5-1 hour at 30-80 degrees C, then lowered the temperature to 50 degrees C, while keeping it for 1-2 hour, and the current density is maintained at 23-40 amperes per square decimeter (A/dm2). The electroplating solution is stirred at the rate of 10 rotations per min (rpm), when the plating solution temperature reached 80 degrees C, the stirring rate is set to 30 rpm and when the plating solution temperature reached 50 degrees C, the stirring rate is 5 rpm. The copper plate is placed in 10 vol.% hydrochloric acid solution and when the copper plate is immersed in the hydrochloric acid solution, the surface of the copper plate is wiped with the steel wire ball, where the wiping time is 10-20 minutes, removed and then rinsed with water to obtain the product.