▎ 摘　　要

NOVELTY - Preparing high heat resistant high thermal conductivity copper clad laminate comprises stirring and mixing the paper base fiber slurry, thermally conductive filler and emulsion adhesive uniformly, adding silica sol and stirring to mix uniformly to obtain a mixed slurry, adding the obtained mixed slurry into mold for hot pressing and solidifying to obtain a reinforced material with high heat resistance and high thermal conductivity, (b) impregnating the high thermal conductivity reinforcing material with epoxy resin glue and semi-curing to obtain a prepreg and (c) laminating the prepreg with or without multi-layer lamination and cladding copper foil on one or both sides and heat-pressing and curing to obtain the copper clad laminate with high heat resistance and high thermal conductivity. USE - The method is useful for preparing high heat-resistant high thermal conductivity copper clad laminate. ADVANTAGE - The clad laminate: has good strength, toughness, heat resistance and thermal conductivity and can greatly improve the performance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a high heat resistant high thermal conductivity copper lad laminate, which is prepared by above method.