• 专利标题:   Surface treatment of through-holes of printed circuit board such as multilayer printed circuit board, involves impregnating board containing through-holes in solution comprising charged and reduced graphene oxide, and cleaning board.
  • 专利号:   WO2021118108-A1, KR2021075553-A
  • 发明人:   YANG W S
  • 专利权人:   KOREA ELECTRONICS TECHNOLOGY INST
  • 国际专利分类:   C23C018/34, H05K003/18, H05K003/42
  • 专利详细信息:   WO2021118108-A1 17 Jun 2021 202153 Pages: 17
  • 申请详细信息:   WO2021118108-A1 WOKR016714 24 Nov 2020
  • 优先权号:   KR166775

▎ 摘  要

NOVELTY - Surface treatment of through-holes of printed circuit board (110) involves (s1) impregnating the printed circuit board containing through-holes in a solution comprising a charged and reduced graphene oxide to form a charged and reduced graphene oxide layer (120) in the through-holes, and (s2) cleaning the printed circuit board. USE - Surface treatment of through-holes of printed circuit board such as multilayer printed circuit board (all claimed) for electronic products. ADVANTAGE - The method is economical, and enables surface treatment of through-holes of printed circuit board capable of forming high-quality plating layer by forming a reliable surface treatment layer, and having suppressed the generation of voids, excellent electroconductivity, and does not smooth due to the flexibility of graphene. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) the printed circuit board; (2) plating of printed circuit board; and (3) a multilayer printed circuit board. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the printed circuit board. Printed circuit board (110) Charged and reduced graphene oxide layer (120)