▎ 摘　　要

NOVELTY - The circuit board (100) has an inner-layer circuit substrate that comprises a first inner-layer circuit layer (12), an inner-layer dielectric layer (11) and a second inner-layer circuit layer that are arranged in a stacked mode. A first heat conductor that penetrates through the inner-layer dielectric layer is connected with the first/second inner-layer circuit layers. An electronic element is positioned on a surface of inner layer circuit substrate and is connected with the first inner circuit layer. A heat storage assembly is positioned on the surface of inner substrate and is connected with the second inner layer circuit layer. A first outer layer circuit substrate is positioned on a surface of the inner substrate and is provided with the electronic element to cover the electronic element. A second outer layer circuit substrate is positioned on the surface of the inner layer circuit substrate and is provided with the heat storage assembly to cover the heat storage assembly. USE - Circuit board for electronic product. ADVANTAGE - The circuit board with the heat accumulation component has the function of storing heat and delaying heat release, avoiding centralized heat release circuit board. The heat generated by the high load of the electronic component to radiate and cause the temperature over the electronic product is prevented. The user experience is improved. The quality of the material for forming heat accumulation assembly is small, and the quality influence of the whole circuit board is small. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a manufacturing method of circuit board. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the third copper layer and the fourth copper layer after forming a first outer circuit layer and a second outer circuit layer, respectively, and forming a solder mask layer. 11Inner layer dielectric layer 12First inner layer circuit layer 13Heat accumulation inner layer circuit layer 14First conductive body 15Heat second heat conductor 20Electronic component heat productivity 37Heat accumulation connector 38Second connector 40First outer layer circuit substrate 41Second dielectric layer 42First outer layer circuit layer 50Second outer layer circuit substrate 51Third dielectric layer 52Heat accumulation outer layer circuit layer 60Anti-welding layer 100Circuit board