▎ 摘　　要

NOVELTY - The electroplating method involves providing a substrate and forming a conductive circuit on the substrate by using a conductive paste. A pre-electroplating copper treatment is carried out on the surface of the conductive circuit, and the cathode current density of the pre-electroplating copper is 0.4-0.6 A/dm^2 to obtain the pre-electroplating copper circuit. The surface of the pre-electroplated copper circuit is subjected to secondary electroplating copper treatment, and the cathode current density of the secondary electroplating copper is 0.8-1.2 A/dm^2. The substrate is a polyimide film. USE - Electroplating method for improving adhesion between conductive circuit and base material. ADVANTAGE - The electroplating method can effectively reduce the internal stress of the electroplated copper layer, and then effectively improve the adhesion between the conductive circuit and the substrate. The quality of the electroplated copper layer is better and the internal stress is smaller when the above electroplating solution is selected, which can further improve the adhesion between the conductive circuit and the substrate.