▎ 摘　　要

NOVELTY - Solid-state filler comprises 60-80 pts. wt. epoxy resin, 20-30 pts. wt. modified epoxy resin, 8-10 pts. wt. phosphorus oxychloride, 12-20 pts. wt. modified graphene, 30-40 pts. wt. modified filler, 4-10 pts. wt. curing agent and 3-5 pts. wt. dispersant, where the surface of modified graphene comprises oxygen-containing group, the modified filler comprises graphene, aluminum oxide and silicon micropowder having particle size of 0.1-0.5 mu m, and the surface of modified epoxy resin is modified with nano-structured core-shell rubber particles. USE - As solid-state filler. ADVANTAGE - The filler has excellent thermal conductivity, and solves the problem that the existing solid filler does not have thermal conductivity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the filler, involving (a) adding graphene, aluminum oxide and silicon micropowder to ethanol solvent, reacting at 35-45 degrees C for 3-5 hours for completely dissolving, after the reaction is completed, washing and drying to obtain modified filler, (b) uniformly mixing graphene, ethanol, sodium hydroxide and cationic surfactant, ultrasonically dispersing, stirring the reaction, filtering, washing until the washing solution is neutral, and drying to obtain modified graphene, and (c) adding epoxy resin, modified epoxy resin, phosphorus oxychloride, modified graphene, curing agent and dispersant to reaction kettle, reacting at 45-55 degrees C for 2-3 hours, adding obtained modified filler, continuously reacting for 1-2 hours, after the reaction is completed, curing and heat-preserving for 1 hour to obtain solid-state filler.