▎ 摘　　要

NOVELTY - The utility model claims a graphene chip processing device, the structure comprises: a sealing protective cover plate, a rolling film placing frame, a film sticking machine main body, a control panel; wafer placing table, further comprising a negative pressure film laminating device; the film sticking machine main body is a rectangular structure; the sealing protective cover plate is located above the film sticking machine main body; the sealing protective cover plate is movably connected with the film sticking machine main body through the rotating shaft; the film rolling placing frame is set at the back of the film sticking machine main body; the wafer placing table is horizontally installed in the film sticking machine main body; the control panel is embedded on the upper surface of the film sticking machine main body; the negative pressure film coating device is located above the wafer placing table in the film sticking machine main body; the utility model is provided with a negative pressure film coating device; when the wafer is coated, negative pressure is formed at the connecting position of the wafer and the film, so as to promote the film and wafer fast joint; at the same time, effectively avoiding bubble generation, improving the film quality.