▎ 摘　　要

NOVELTY - A laminated structure (100) comprises a substrate (21), at least one adjustment layer stacked on the substrate (21) and having Debye temperature, which is lower than the Debye temperature of the substrate (21), at least one bonding layer stacked on the adjustment layer and having a Debye temperature, which is less than the Debye temperature of the adjustment layer, and a substrate (22) stacked on the bonding layer and having a Debye temperature less than the Debye temperature of the substrate (21). The Debye temperature mismatch between the substrate (22) and the bonding layer is less than the Debye temperature mismatch between the substrate (22) and substrate (21). USE - Laminated structure used for electronic device. Uses include but are not limited to high-power chips, systems on chips, high electron mobility transistors (HEMT), monolithic microwave integrated circuits, and lasers. ADVANTAGE - Because the Debye temperature mismatch between the adjusting layer and the first substrate is small, the interface thermal resistance between the two is small so as to have a higher heat transfer efficiency between them. The bonding effect between the first and second substrates can be improved, so that the heat dissipation capability of the electronic device can be increased. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of the laminated structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the laminated structure. (Drawing includes non-English language text) 21,22Substrates 31Interface thermal resistance adjustment layer 41Bonding layer 100Laminated structure