• 专利标题:   Forming electromagnetic interference shielding structure involves forming rectangular electromagnetic interference shielding panels that each comprise first end and second end, affixing pair of rectangular electromagnetic interference shielding panels orthogonal to each other at their first ends.
  • 专利号:   US2023180446-A1
  • 发明人:   BOLAR T, REDMOND K, SCHEFFER D
  • 专利权人:   VORBECK MATERIALS CORP
  • 国际专利分类:   H05K009/00
  • 专利详细信息:   US2023180446-A1 08 Jun 2023 H05K-009/00 202348 English
  • 申请详细信息:   US2023180446-A1 US986529 14 Nov 2022
  • 优先权号:   US247753P, US986529

▎ 摘  要

NOVELTY - Forming electromagnetic interference (EMI) shielding structure involves forming rectangular EMI shielding panels that each comprise a first end and a second end, affixing a pair of rectangular EMI shielding panels orthogonal to each other at their first ends, overlapping successively the pair of rectangular EMI shielding panels over each other to form a interconnected EMI shielding plane, and affixing the pair of rectangular EMI shielding panels to each other at their second ends to form a helical EMI shielding ("hexagonal electromagnetic interference shielding" (HES)) structure that unfolds to an unfolded state and folds to a folded state along its center axis, where the interconnected EMI shielding plane is each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. USE - Method for forming electromagnetic interference shielding structure. ADVANTAGE - The method can prevent the transmission ofEM radiation by reflection and/or absorption ofthe EM radiation or by suppressing the EM signals, so that EM waves do not affect the functioning and durability of electronic equipment. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electromagnetic interference (EMI) shielding structure, which comprises: interconnected EMI shielding plane, and a conductive composition, where the interconnected EMI shielding plane comprises a pair of rectangular EMI shielding panels that each comprise a first end and a second end, are affixed orthogonal to each other at their first ends, successively overlap each other to form an interconnected EMI shielding plane, affixed at their second ends to form a helical EMI shielding ("HES") structure, where the HES structure unfolds to an unfolded state and folds to a folded state along its center axis, the conductive composition is positioned on each EMI shielding panel, and the interconnected EMI shielding plane is each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. DESCRIPTION OF DRAWING(S) - The drawing shows a side view of a hexagonal electromagnetic interference shielding ("HES") structure. 105a, 105bEMI shielding panels 110Top end 115Bottom end 125Helical structure 130Unfolded state