• 专利标题:   Conductive structure, comprises conductive material layer including metal and work function control layer including two-dimensional material with defect, to control work function of conductive structure.
  • 专利号:   US2021355582-A1, KR2021141128-A, CN113675258-A
  • 发明人:   LEE C, KIM C, LEE E, BYUN K, KIM S, SHIN H, SHIN H J, BYUN K E, LEE C S, LI C, JIN C, LI Y, JIN S, SHEN X
  • 专利权人:   SAMSUNG ELECTRONICS CO LTD, SAMSUNG ELECTRONICS CO LTD
  • 国际专利分类:   C01B021/064, C01B025/00, C01B032/182, C23C016/26, C23C016/32, C23C016/50, H01B001/04, H01B001/06, H01B013/00, H01B005/14, H01L029/06, H01L029/36
  • 专利详细信息:   US2021355582-A1 18 Nov 2021 C23C-016/50 202219 English
  • 申请详细信息:   US2021355582-A1 US318238 12 May 2021
  • 优先权号:   KR058364

▎ 摘  要

NOVELTY - Conductive structure 200 comprises a conductive material layer 210 including metal, and a work function control layer 220 bonded to the conductive material layer, where the work function control layer includes a two-dimensional material with a defect, and the work function control layer is configured to control a work function of the conductive structure by being bonded to the conductive material layer. USE - Conductive structure. ADVANTAGE - The conductive structure has high electrical mobility, excellent thermal properties and chemical stability and a large surface area. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: 1. a method for controlling a work function of metal, which involves controlling the work function by bonding a work function control layer to a conductive material layer including metal; and 2. a bonding structure, which comprises the conductive material layer including metal and work function control layer, where the conductive material layer and work function control layer form the bonding structure, according to a change in a thickness of the work function control layer, the work function of the bonding structure does not change or a change rate of the work function of the bonding structure is within 90%, and the work function of the bonding structure is less than a work function of the conductive material layer. DESCRIPTION OF DRAWING(S) - The drawing shows a conductive structure. 200Conductive structure 210Conductive material layer 220Work function control layer