▎ 摘　　要

NOVELTY - The device (100) has a cover component provided with a first covering element (42) and a second covering component (46). The first covering element is connected with a first supporting frame is provided. The second covering element is connected with a second supporting frame. The cover component covers the connecting piece, where the cover component is formed of graphene silica gel. A circuit board component (20) is arranged between the first supporting frame and the first covering component. The cover component covers a flexible heat dissipation piece and the connecting element. The connecting element comprises a hinge. USE - Bendable electronic device. ADVANTAGE - The device reduces heat dissipation difficulty and avoids overheat local temperature of covering part. DESCRIPTION OF DRAWING(S) - The drawing shows an exploded perspective view of a bendable electronic device. Conductive layer (12) Circuit board component (20) Covering elements (42,46) Battery (50) Bendable electronic device (100)