▎ 摘　　要

NOVELTY - The method involves manufacturing through-silicon via (TSV) holes (102) in the lower surface of the heat dissipation adapter plate (101) through photoetching and etching processes. A graphene coating is coated on the opening surface of the TSV hole by spin coating and vapor deposition. The graphene coating covering the metal column is removed through photoetching and etching processes. The front surface of the heat dissipation adapter plate is thinned through a grinding process to expose the bottom of the metal column. The heating chip on the lower surface of a heat dissipation adapter plate is bonded through a hot-press bonding process. The bottom of the chip to be in direct contact with a graphene coating is enabled on the heat dissipation adapter plate to form the three-dimensional heterogeneous module. USE - Manufacturing method of three-dimensional heterogeneous module based on graphene as heat dissipation coating. ADVANTAGE - The thin graphene is combined to be arranged as the heat dissipation material, so that the heating chip is in full contact with the graphene coating. The heat of the surface heating portion can be quickly conducted to the whole surface by the graphene and the local overheating of the chip is avoided. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of a heat dissipation adapter plate provided with TSV holes. Heat dissipation adapter plate (101) Through-silicon via hole (102)