• 专利标题:   Low impedance multilayer circuit board, has plate body whose bottom part is provided with silicon carbide coating layer, and graphene radiating layer located at top part of silica gel layer, where bottom part of coating layer is provided with coating layer.
  • 专利号:   CN211457503-U
  • 发明人:   WANG W
  • 专利权人:   WANG W
  • 国际专利分类:   H05K001/02
  • 专利详细信息:   CN211457503-U 08 Sep 2020 H05K-001/02 202076 Pages: 6 Chinese
  • 申请详细信息:   CN211457503-U CN22128320 30 Nov 2019
  • 优先权号:   CN22128320

▎ 摘  要

NOVELTY - The utility model claims a low impedance multilayer circuit board, comprising a plate body, the bottom of the plate body is provided with a silicon carbide paint layer; the bottom of the silicon carbide paint layer is provided with a zinc oxide paint layer; the surface of the plate body is provided with a radiating layer; the inner cavity of the radiating layer is orderly provided with a polystyrene paint layer from up to down, a graphene radiating layer and a silica gel layer; the polystyrene coating layer is located on the top of the graphene radiating layer; the graphene radiating layer is located at the top of the silica gel layer. The utility model through radiating layer, polystyrene coating layer, graphene radiating layer and silica gel layer are matched with each other; the multilayer circuit board can be used when using; the multilayer circuit board has the function of radiating; the multilayer circuit board has better effect when using; it avoids the circuit board when using, the circuit board does not have heat dissipation effect, so that the circuit board is used for a long time, The circuit board has self-ignition condition, suitable for popularization and use.