▎ 摘　　要

NOVELTY - High thermal conductivity epoxy resin composite material comprises 100 pts. wt. epoxy resin, 10-25 pts. wt. the mixed thermally conductive filler, 10-13 pts. wt. triethylenetetramine curing agent, 7-10 pts. wt. acetone and 5-9 pts. wt. magnesium hydroxide powder. The mixed thermally conductive filler includes six types of fillers, the six types of fillers are modified alumina, aluminum nitride, boron nitride nanotubes, modified nano silicon nitride, and modified carbide Silicon and graphene oxide. The mass ratio of the modified alumina, the aluminum nitride, the boron nitride nanotube, the modified nano silicon nitride, the modified silicon carbide and the graphene oxide is 1:1-2:2-4:2-4:0.1-0.4:1-3. USE - High thermal conductivity epoxy resin composite material. ADVANTAGE - The high thermal conductivity epoxy resin composite material has the best thermal conductivity, and its thermal conductivity can reach 4.6W/(m.K). DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing a highly thermally conductive epoxy resin composite material, which involves: (A) weighing the proportion of epoxy resin into the reactor, and then adding the proportion of acetone, mixed thermal conductive filler and magnesium hydroxide powder in turn, stirnf for 20-40 minutes, and adding the proportion of triethylenetetramine curing agent, then stirring for 5-15 min, vacuuming for 1.5-2.5 hours at 20-28 degrees C until there are no bubbles in the solution and then solidify under normal pressure; and (B) curing at room temperature at 18-22 degrees C for 10-14h, and then cured at 110-125 degrees C for 2.5-3h to prepare epoxy resin composite material.