▎ 摘　　要

NOVELTY - A through-hole plating method involves grafting graphene oxide with gamma -aminoethylaminopropyltrimethoxysilane to obtain product (A), adsorbing product of active metal ions to give product (B), physical adsorbing product (B) on surface of insulating substrate of through-hole wall of printed circuit board, forming an adsorption layer, converting adsorption layer into conductive layer through chemical reduction process, and electroplating through-hole wall of printed circuit board processed to form metal layer to realize interconnection of through-holes. USE - Through-hole plating method for printed circuit boards. ADVANTAGE - The method provides formation of high-density oxygen functional sites at graft interface, effectively improve adsorption capacity of active metal ions, ethylenediamine group on surface of conductive layer can effectively improves ability to capture copper ions in solution during electroplating process. Accelerates mass transfer of copper ions, which is beneficial to accelerated deposition of copper plating in hole, thereby greatly enhancing the uniform plating ability of plating solution.