• 专利标题:   Preparing polymer-based heat conductive complex material with a sandwich structure comprises alternately arranging a heat-conducting filler layer and a polymer layer, and hot-pressing.
  • 专利号:   CN116176075-A
  • 发明人:   ZHOU J, LIU Y
  • 专利权人:   UNIV BEIJING CHEM TECHNOLOGY
  • 国际专利分类:   B32B027/02, B32B027/12, B32B027/20, B32B027/28, B32B027/30, B32B037/06, B32B037/10, B32B038/00, D01D005/00, D04H001/4282, D04H001/43, D04H001/4309, D04H001/4318, D04H001/4326, D04H001/728, D06M101/24, D06M011/80
  • 专利详细信息:   CN116176075-A 30 May 2023 B32B-027/02 202355 Chinese
  • 申请详细信息:   CN116176075-A CN10068403 06 Feb 2023
  • 优先权号:   CN10068403

▎ 摘  要

NOVELTY - Preparing polymer-based heat conductive complex material with a sandwich structure comprises alternately arranging a heat-conducting filler layer and a polymer layer, and hot-pressing, where the polymer layer is polymer fiber felt prepared by solution electrostatic spinning, the polymer includes polyvinyl alcohol, polyacrylonitrile, polyvinylidene fluoride, polyimide, and/or polystyrene, the heat conducting filler layer is obtained by vacuum filtering and depositing the heat conducting filler dispersion on the surface of the polymer fiber felt, the sheet shaped heat conducting filler includes boron nitride nano sheet, graphite sheet, graphene oxide nano sheet, and/or nitride (MXene), the surface functionalization is that dopamine is polydopamine through self-polymerization, the added mass of the heat conducting filler in the polymer-based heat conducting complex material with a sandwich structure is 10-40 wt.%. USE - The prepareed polymer-based heat-conducting complex material with sandwich structure is used in electronic component, communication device and radiating fields. ADVANTAGE - The polymer-based heat-conducting complex material with sandwich structure has good flexibility and mechanical strength.