▎ 摘　　要

NOVELTY - Preparing polymer-based heat conductive complex material with a sandwich structure comprises alternately arranging a heat-conducting filler layer and a polymer layer, and hot-pressing, where the polymer layer is polymer fiber felt prepared by solution electrostatic spinning, the polymer includes polyvinyl alcohol, polyacrylonitrile, polyvinylidene fluoride, polyimide, and/or polystyrene, the heat conducting filler layer is obtained by vacuum filtering and depositing the heat conducting filler dispersion on the surface of the polymer fiber felt, the sheet shaped heat conducting filler includes boron nitride nano sheet, graphite sheet, graphene oxide nano sheet, and/or nitride (MXene), the surface functionalization is that dopamine is polydopamine through self-polymerization, the added mass of the heat conducting filler in the polymer-based heat conducting complex material with a sandwich structure is 10-40 wt.%. USE - The prepareed polymer-based heat-conducting complex material with sandwich structure is used in electronic component, communication device and radiating fields. ADVANTAGE - The polymer-based heat-conducting complex material with sandwich structure has good flexibility and mechanical strength.