• 专利标题:   Producing copper-plated nanoparticles graphene conductive ink, comprises e.g. mixing copper-plated nanoparticles graphene conductive filler and organic solvent, adding thermoplastic resin, mixing, and ultrasonically dispersing.
  • 专利号:   CN108753044-A
  • 发明人:   MA Y, JI H, AN B, LIU L, LIU Y, LI M, REN P
  • 专利权人:   UNIV SHENYANG JIANZHU
  • 国际专利分类:   C09D011/52, C09D011/14, C09D011/102
  • 专利详细信息:   CN108753044-A 06 Nov 2018 C09D-011/52 201883 Pages: 8 Chinese
  • 申请详细信息:   CN108753044-A CN10567362 05 Jun 2018
  • 优先权号:   CN10567362

▎ 摘  要

NOVELTY - Producing copper-plated nanoparticles graphene conductive ink, comprises (a) mixing 5-20 wt.% copper-plated nanoparticles graphene conductive filler, 10-60 wt.% thermoplastic resin, 0.1-10 wt.% auxiliary agent and remaining amount of organic solvent, (b) adding thermoplastic resin and auxiliary agent into organic solvent, mixing to obtain a connecting material, (c) ultrasonically dispersing by adding copper-plated nano-graphene conductive filler into organic solvent to obtain uniform dispersion, and (d) adding the obtained dispersion into the connecting material, mechanically stirring, and grounding. The weight fraction of graphene in copper-plated nanoparticles graphene conductive filler is 6-50 wt.%. The auxiliary agent includes antifoaming agent, leveling agent, coupling agent, thixotropic agent and/or metal conductive material antioxidant. USE - The method is useful for producing copper-plated nanoparticles graphene conductive ink. ADVANTAGE - The conductive ink has excellent performance, good bending resistance and printability. DETAILED DESCRIPTION - Producing copper-plated nanoparticles graphene conductive ink, comprises (a) mixing 5-20 wt.% copper-plated nanoparticles graphene conductive filler, 10-60 wt.% thermoplastic resin, 0.1-10 wt.% auxiliary agent and remaining amount of organic solvent, (b) adding thermoplastic resin and auxiliary agent into organic solvent, mixing to obtain a connecting material, (c) ultrasonically dispersing by adding copper-plated nano-graphene conductive filler into organic solvent to obtain uniform dispersion, and (d) adding the obtained dispersion into the connecting material, mechanically stirring, and grounding. The weight fraction of graphene in copper-plated nanoparticles graphene conductive filler is 6-50 wt.%. The auxiliary agent includes antifoaming agent, leveling agent, coupling agent, thixotropic agent and/or metal conductive material antioxidant. The organic solvent includes ethylene glycol dimethyl ether, vinyl n-butyl ether, butanone, butanol, ethylene glycol butyl ether, cyclohexanone, isopropylidene acetone, ethylene glycol phenyl ether, diethylene glycol butyl ether, isophorone, acetophenone, diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, terpineol, butyl acetate, ethyl acetate and/or cellosolve acetate.