▎ 摘　　要

NOVELTY - The embodiment of the utility model claims a circuit board, comprising: a radiating base body made of heat good conductor, a heat conducting insulating layer paved on the top surface of the radiating base body and a circuit copper foil layer pressed on the surface of the heat conducting insulating layer; the bottom surface and/or side surface of the radiating base body is further formed with multiple radiating fins. the radiating substrate is made of the following materials: aluminium, copper, heat conducting ceramic or graphene. the heat-conducting insulating layer is made of heat-conducting silica gel or graphene. the outer surface of the circuit copper foil layer is further provided with a solder mask layer. The embodiment of the utility model directly forms the needed circuit on the circuit copper foil layer according to the actual need by directly laying the heat-conducting insulating layer on the top surface of the radiating base body made of the heat good conductor and then pressing the circuit copper foil layer, and further forming a radiating fin on the bottom surface and/or side surface of the radiating base body; It can effectively improve the radiating performance of the circuit board.