• 专利标题:   Method for fabricating graphene-based device e.g. FET for electronic application, involves forming graphene layer over FET and forming protective layer over graphene layer.
  • 专利号:   US2010051897-A1, US7858989-B2
  • 发明人:   CHEN A, KRIVOKAPIC Z
  • 专利权人:   ADVANCED MICRO DEVICES INC, GLOBALFOUNDRIES INC
  • 国际专利分类:   H01L021/04, H01L029/16, H01L029/15
  • 专利详细信息:   US2010051897-A1 04 Mar 2010 H01L-029/16 201018 Pages: 11 English
  • 申请详细信息:   US2010051897-A1 US201801 29 Aug 2008
  • 优先权号:   US201801

▎ 摘  要

NOVELTY - The method involves forming a trench (12) in a substrate (10). A device structure such as a FET is formed within the trench. A graphene layer (20) is formed over the FET. A protective layer is formed over the graphene layer. USE - Method for fabricating graphene-based device e.g. FET, p-n junction device (all claimed) and bipolar device for electronic application. Can also be used in large-scale circuit. ADVANTAGE - The fabrication process is simplified, thus enables larger variety of device dimensions and structures for graphene device. The reliability of the circuit is increased. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for graphene-based device. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the graphene-based FET structure. Substrate (10) Trench (12) Metal contact (16) Graphene layer (20) Protective insulator cap (22)