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  • 专利标题:   Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.
  • 专利号:   US2021298169-A1, CN113493602-A, TW202136408-A, TW765482-B1, TW202229446-A, US11503708-B2
  • 发明人:   CHANG C, WU Y, ZHANG C
  • 专利权人:   ITEQ CORP, JIANGXI LIANMAO ELECTRONIC TECHNOLOGY CO, ITEQ CORP, ITEQ CORP
  • 国际专利分类:   H05K001/03, H05K001/02, B32B033/00, B32B027/20, B32B027/04, B32B005/02, B32B015/14, C08J005/24, C08K007/00, C08K007/18, C08K007/24, C08K003/40, C08K007/26, C08L009/00, C08L071/12, C08K013/04
  • 专利详细信息:   US2021298169-A1 23 Sep 2021 H05K-001/03 202189 English
  • 申请详细信息:   US2021298169-A1 US204962 18 Mar 2021
  • 优先权号:   US992156P, US204962

▎ 摘　　要

NOVELTY - Resin composition used to form dielectric substrate layer, comprises 10-60 vol.% polymeric based material and 1-80 vol.% fillers comprising hollow fillers comprising a first hollow filler, and a material of the first hollow filler is silicon dioxide. USE - The resin composition is useful to form dielectric substrate layer and prepreg used to form printed circuit board ADVANTAGE - The composition enhances thermal stability of the prepreg and dielectric substrate layer, reduces the dielectric loss of the prepreg and dielectric substrate layer, and has excellent thermal stability and excellent dielectric properties. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) A prepreg. (2) A printed circuit board.