▎ 摘　　要

NOVELTY - A heat spreader (200) comprises a copper substrate layer (102), and at least one layer of graphene (104) deposited on the copper substrate layer. USE - Heat spreader is used for dissipating heat generated in electronic device. ADVANTAGE - The improved, efficient and light-weight heat spreader is equipped with graphene to provide high mechanical robustness and thermal conductivity. The doped graphene exhibits excellent adhesion properties with the copper substrate layer. The functional groups of the functionalized graphene enhance adhesion of doped graphene on the surface of the copper substrate layer, and exhibit excellent thermal conductivity, when contacted with heat source in comparison with the synthesized graphene solely comprising carbon atoms. The heat spreader improves life expectancy and reliability of electronic device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of the heat spreader. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the heat spreader. Copper substrate layer (102) Layer of grapheme (104) Heat spreader (200) Top layer of graphene (202)