▎ 摘　　要

NOVELTY - The present disclosure provides a packaging structure, including: a substrate; a connection pad disposed on the substrate; a conductive part disposed on the connection pad and electrically connected to the substrate, wherein the conductive part includes: a first metal layer; and a graphene composite layer disposed on the first metal layer; and an insulating protection layer surrounding the connection pad on the substrate and having an opening, wherein a top surface of the conductive part exposes in the opening.