▎ 摘　　要

NOVELTY - Method for preparing high thermal conductivity polyimide film, involves (a) mixing alkynylated graphene and N,N-dimethylformamide, ultrasonically dispersing for 30-40 minutes to obtain a solution (A), ultrasonically dispersing magnetic boron azide and N,N-dimethylformamide for 30-40 minutes after mixing, gradually adding solution (A), evenly stirring, adding sodium ascorbate and triethylamine, adding copper sulfate pentahydrate under nitrogen environment, reacting at 40-50℃ for 20-24 hours, reacting, suction filtering, washing, and vacuum drying to obtain a thermally conductive filler, and (b) taking diamine monomer and N,N-dimethylformamide, adding pyromellitic anhydride, thermally conductive filler and graphene oxide after mixing uniformly, stirring, reacting for 5-6 hours to obtain a polyamic acid solution, filming the polyamic acid solution, inducing to align in a magnetic environment, drying at 140-150℃, and thermally imidizing to obtain the polyimide film. USE - The method is useful for preparing high thermal conductivity polyimide film (claimed). ADVANTAGE - The method prepared the polyimide film with excellent heat-conducting performance in the vertical direction and the horizontal direction, and excellent heat resistance, improves the crosslinking degree of the heat conducting filler and polyimides, and improves the mechanical property of the film.