• 专利标题:   Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure, and includes graphene microspheres, epoxy resin and curing agent.
  • 专利号:   CN110511535-A
  • 发明人:   ZENG X, LI C, SUN R, ME Y
  • 专利权人:   SHENZHEN INST ADVANCED TECHNOLOGY
  • 国际专利分类:   C08G059/50, C08G059/56, C08G059/62, C08K007/18, C08L063/00, C09K005/14
  • 专利详细信息:   CN110511535-A 29 Nov 2019 C08L-063/00 201997 Pages: 9 Chinese
  • 申请详细信息:   CN110511535-A CN10494733 22 May 2018
  • 优先权号:   CN10494733

▎ 摘  要

NOVELTY - Graphene microsphere/epoxy resin composite material has a hexagonal honeycomb structure, and includes 5-50 wt.% graphene microspheres, 30-60 wt.% epoxy resin and 30-60 wt.% curing agent. USE - Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure. ADVANTAGE - The graphene microsphere/epoxy resin composite material is simple and gentle for industrial production. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing a graphene microsphere/epoxy resin composite material, which involves: (A) dropping the graphene oxide aqueous solution/hydrogel into a reactor containing liquid nitrogen to form a graphene oxide hydrogel; (B) cooling and freeze-drying the graphene oxide hydrogel to obtain graphene oxide microspheres; (C) reducing the graphene oxide microspheres with an 80 wt.% concentration hydrazine hydrate solution and freeze-drying to obtain three-dimensional graphene microspheres; (D) adding a curing agent and a catalyst to the epoxy resin solution and mixing to obtain an epoxy resin mixture; and (E) pouring epoxy resin mixture into a mold filled with the three-dimensional graphene microspheres, and vacuum-curing and heat-curing to obtain a graphene microsphere/epoxy composite material.