• 专利标题:   Preparing toughening high heat-conducting filler based on thermosetting resin for improving toughness and heat conductivity of thermosetting resin, involves firstly dispersing functionalized carbon material in solvent A, then dropping isocyanate into obtained functionalized carbon material solution.
  • 专利号:   CN114426674-A, CN114426674-B
  • 发明人:   LIU K, ZHU X, WENG L, YU Y, XU H, ZHANG X
  • 专利权人:   UNIV HARBIN SCI TECHNOLOGY
  • 国际专利分类:   C08G083/00, C08L063/02, C08L087/00
  • 专利详细信息:   CN114426674-A 03 May 2022 C08G-083/00 202263 Chinese
  • 申请详细信息:   CN114426674-A CN11510775 10 Dec 2021
  • 优先权号:   CN11510775

▎ 摘  要

NOVELTY - Preparing toughening high heat-conducting filler based on thermosetting resin involves firstly dispersing the functionalized carbon material in the solvent A, then dropping isocyanate into the obtained functionalized carbon material solution, performing differential centrifugal treatment, subjecting obtained solid for vacuum drying, firstly adding the unsaturated anhydride and isocyanate into the solvent, then adding nitrile rubber and solid product, stirring and reacting, stirring and evaporating the solvent to obtain product. USE - Method for preparing toughening high heat-conducting filler based on thermosetting resin used for improving the toughness and heat conductivity of the thermosetting resin (claimed). ADVANTAGE - The method improves the toughness and heat conductivity of the material, improves heat-conducting coefficient of the epoxy resin E-51 to 0.3813W/m K, and elastic modulus to 1744.6N/mm2.