▎ 摘　　要

NOVELTY - The biosensor has a device main body component (1) fixed on a printed circuit board (PCB) and provided with a semiconductor layer e.g. N-doped silicon wafer, a silicon dioxide layer and a positive metal electrode. The silicon dioxide layer is formed with multiple grooves. An insulating layer e.g. graphene oxide film, is provided between the positive metal electrode and the semiconductor layer when the positive metal electrode is placed in the groove to form a metal-insulator-semiconductor (MIS) tunnel junction. The PCB is provided with a bottom plate. An electrode sheet is arranged on the bottom plate. The positive metal electrode is connected with a negative metal electrode by a lead. An external power supply is connected with a power supply. USE - MIS structure based thin film type electroluminescent local surface plasma resonance (LSPR) biosensor. ADVANTAGE - The biosensor utilizes mode of external direct current voltage to generate electroluminescence, which avoids use of external light source in LSPR technology. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of a MIS structure based thin film type electroluminescent LSPR biosensor. Device main body component (1) Device nano-particle (2) PCB connection part (3)