▎ 摘　　要

NOVELTY - Modifying printed circuit boards (PCB) by ball milling with silicate fillers comprises (1) mixing silicon dioxide, calcium oxide and aluminum oxide in a weight ratio of 6:3:1 to form a compound silicate, and then stirring and modifying by modification treatment agent, (2) preparing coupling agent compounding agent, (3) adding coupling agent compounding agent with a total amount of 10-20 wt.% of the compound silicate to the compound silicate modified in the step (1), and performing heat treatment, (4) sending to the ball mill for ball milling, after the ball milling is finished, washing using water and drying, (5) performing heat treatment at 75-85°C for 5-10 minutes, and cooling down at constant temperature. USE - The method is useful for modifying printed circuit boards (PCB) by ball milling with silicate fillers. ADVANTAGE - The silicate filler is compounded with silicon dioxide, calcium oxide and aluminum oxide, is modified by stirring with a modification treatment agent, the modification treatment agent adopts lanthanum chloride solution, sodium oxalate and sodium alkylsulfonate, which improves the activity of the matrix liquid in the modification treatment agent, and facilitates the improvement of the activity performance of the filler. DETAILED DESCRIPTION - Modifying printed circuit boards (PCB) by ball milling with silicate fillers comprises (1) mixing silicon dioxide, calcium oxide and aluminum oxide in a weight ratio of 6:3:1 to form a compound silicate, and then stirring and modifying by modification treatment agent, where the specific method of the stirring and modifying by modification treatment agent is: (S101) adding 5-10 pts. wt. sodium oxalate to 20-30 pts. wt. lanthanum chloride solution, adding 2-5 pts. wt. sodium alkylsulfonate and 4-7 pts. wt. modified graphene to obtain graphene composite rare earth modified liquid, (S102) adding 2-6 pts. wt. processing additives into the graphene composite rare earth modified liquid, and stirring fully to obtain a modification treatment agent, and (S103) adding the compound silicate to the modification treatment agent in a weight ratio of 1:7, stirring at 65-75°C for 30-40 minutes, where the stirring speed is 450-550 revolutions/minute, after stirring, washing using water, and drying, (2) preparing coupling agent compounding agent, (3) adding coupling agent compounding agent with a total amount of 10-20 wt.% of the compound silicate to the compound silicate modified in the step (1), and performing heat treatment, (4) sending to the ball mill for ball milling, after the ball milling is finished, washing using water and drying, (5) performing heat treatment at 75-85°C for 5-10 minutes, and cooling down at constant temperature.