• 专利标题:   Manufacture of nickel metal film-coated N-type doped silicon nitride growth controllable graphene material involves growing nickel metal film on composite substrate obtained from silicon nitride, and chemical vapor depositing.
  • 专利号:   CN103540907-A, CN103540907-B
  • 发明人:   FENG Z, LI J, LIU Q, WEI C, HE Z
  • 专利权人:   CHINA ELECTRONICS TECHNOLOGY GROUP CORP, 13TH RES INST CHINA ELECTRONIC SCI TEC
  • 国际专利分类:   C23C016/02, C23C016/26
  • 专利详细信息:   CN103540907-A 29 Jan 2014 C23C-016/02 201423 Pages: 12 Chinese
  • 申请详细信息:   CN103540907-A CN10472153 11 Oct 2013
  • 优先权号:   CN10472153

▎ 摘  要

NOVELTY - A composite substrate is obtained by carrying out epitaxial growth of silicon nitride on surface of base substrate, cleaned and dried. A nickel metal film is grown on composite substrate, and composite substrate is added into a furnace, to form N-enriched silicon nitride structure. The nickel-silicon alloy surface layer is removed using etching agent. The substrate is added into chemical vapor deposition device, heated, argon gas, hydrogen and gaseous carbon source are introduced, and nickel metal film-coated N-type doped silicon nitride growth controllable graphene material. USE - Manufacture of nickel metal film-coated N-type doped silicon nitride growth controllable graphene material (claimed). DETAILED DESCRIPTION - A composite substrate is obtained by carrying out epitaxial growth of silicon nitride on the surface of base substrate. The composite substrate is cleaned and dried. A nickel metal film is grown on the surface of composite substrate, and obtained nickel/silicon nitride/base superalloy composite substrate is added into a furnace, nickel atoms and silicon atoms form nickel-silicon alloy at high temperature, nitrogen atoms remaining on the surface of silicon nitride exists as unsaturated bond, and N-N bond is reconstructed to form N-enriched silicon nitride structure. The thickness of metal film and alloy temperature determines nitrogen atom number on the surface of silicon nitride surface. The nickel-silicon alloy surface layer is removed using etching agent. The composite substrate is added into chemical vapor deposition device, heated, argon gas, hydrogen and gaseous carbon source are introduced, and nickel metal film-coated N-type doped silicon nitride growth controllable graphene material.