▎ 摘　　要

NOVELTY - A high-heat dissipation glue comprises 20-50 pts. wt. polyimide resin, 5-10 pts. wt. curing agent, 40-80 pts. wt. acetone solvent and 20-30 pts. wt. thermal filler including 2 or more of rare-earth oxide, graphene, nano carbon powder, porcelain, boron nitride and silicon carbide. USE - High-heat dissipation glue is used for aluminum-based copper clad laminate. ADVANTAGE - The high-heat dissipation glue improves heat exchange rate, and quickly reduces internal temperature of surface of target, and fully protects aluminum substrate surface, and improves service life of copper clad laminate. After curing, the glue has excellent chemical stability.