▎ 摘　　要

NOVELTY - A low-melting-point lead-free solder alloy comprises 5-10 wt.%, preferably 7 wt.% zinc, 0.1-0.2 wt.%, preferably 0.15 wt.% nickel, 0.3-0.5 wt.%, preferably 0.4 wt.% copper, 2-4 wt.%, preferably 3 wt.% bismuth, 0.6-2.4 wt.%, preferably 1.8 wt.% graphene, and remainder of tin. USE - Low-melting-point lead-free solder alloy is used for forming electronic component. ADVANTAGE - The solder alloy has excellent weldability and oxidation resistance, and efficiently provides lightweight and compact electronic component. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of low-melting-point lead-free solder alloy.