▎ 摘　　要

NOVELTY - Solder ball, is claimed. The material of the solder ball is a conductive polymer material. The conductive polymer material is conductive polyaniline. The solder ball of comprises a conductive support core, where the conductive polymer material coating the conductive support core. The material of the conductive support core includes copper, silver or gold. The nano-conductive particles include nano-copper particles, nano-gold particles, nano-silver particles, carbon nanotubes or graphene. USE - Used as solder ball. ADVANTAGE - The conductive polymer material has good mechanical performance, light weight, capable of providing stable support in the vertical direction in the laminated structure, and can make the weight of the laminate structure is small. It has good processability, with conductive, characteristics can realize the physical connection and electric connection between the electronic elements. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: flip chip structure; tacked package structure; and manufacturing method of stacked package structure. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic cross-sectional view of a solder ball. 10Solder ball