▎ 摘　　要

NOVELTY - A cured product comprises a composition comprising a resin or a resin precursor, and a filler having thermal conductivity of 1 W/m.K or more, comprising 18-80 vol.% filler (A) with aspect ratio which is ratio of average value of maximum length to average value of minimum length of 1.0-1.9, and filler (B) with aspect ratio of 2 or more and average maximum length of 10.5-200.0 mu m, (in total). The volume ratio of component (A) and (B) in the composition is 95:5-55:45. The cured product has thermal conductivity of 0.3-10 W/m.K at 25 degrees C and elastic modulus at -70 degrees C of 0.01-100 MPa. USE - Cured product used in form of sheet for multilayer sheet for heat radiating component such as heat spreader, wiring board and heat sink and electronic component (all claimed) such as semiconductor chip. Uses include but are not limited to semiconductor package, display, LED and electric light. ADVANTAGE - The cured product has high thermal conductivity and low elasticity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for multilayer sheet, which comprises the cured product and an adhesive layer.