• 专利标题:   Rapidly forming metallized solder joint on surface of graphene film involves cutting graphene film, clamping to substrate, heating substrate to melt coating material, applying pressure, driving graphene film, and ultrasonic-coating.
  • 专利号:   CN108249422-A
  • 发明人:   XIAO Y, WU Z, HE D, FU H
  • 专利权人:   UNIV WUHAN TECHNOLOGY
  • 国际专利分类:   C01B032/182, C01B032/914, C01B032/921, C23C002/04, C23C002/32
  • 专利详细信息:   CN108249422-A 06 Jul 2018 C01B-032/182 201851 Pages: 9 Chinese
  • 申请详细信息:   CN108249422-A CN10176021 02 Mar 2018
  • 优先权号:   CN10176021

▎ 摘  要

NOVELTY - Rapidly forming metallized solder joint on surface of graphene film comprises cutting graphene film into desired shape, clamping perpendicularly to substrate on telescopic fixture, placing coating material required for metallizing surface of graphene film in V-shaped metal bath on substrate, heating substrate to melt coating material while blowing protective atmosphere into V-shaped metal melting tank through protective gas nozzle set above substrate to prevent oxidation of coating metal liquid, applying ultrasonic vibrating rod perpendicularly to surface of substrate near V-shaped metal melting tank, applying pressure, opening ultrasonic vibration to dissolve substrate metal and enter molten coating metal liquid, driving graphene film by telescopic fixture to vertically protrude into molten coating metal liquid, and ultrasonic-coating. USE - Method of rapidly forming metallized solder joint on surface of graphene film. ADVANTAGE - The method can rapidly form solder joint and completely infiltrate into graphene film.