• 专利标题:   Manufacture of circuit board involves insulating flat plate of copper layer formed on one side surface of pin layer, patterning pinned layer, exposing specific pattern by removing copper layer and etching graphene layer.
  • 专利号:   KR2013132103-A
  • 发明人:   NA D H
  • 专利权人:   SAMSUNG TECHWIN CO LTD
  • 国际专利分类:   H05K001/02, H05K003/06
  • 专利详细信息:   KR2013132103-A 04 Dec 2013 H05K-003/06 201401 Pages: 12
  • 申请详细信息:   KR2013132103-A KR056227 25 May 2012
  • 优先权号:   KR056227

▎ 摘  要

NOVELTY - Manufacture of circuit board involves insulating flat plate of a copper layer formed on one side surface of the pin layer, patterning pinned layer having specific pattern, exposing specific pattern by removing copper layer, etching graphene layer and removing pinned layer. USE - Manufacture of circuit board (claimed). ADVANTAGE - The circuit board is efficiently manufactured. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for circuit board.