• 专利标题:   Thermal interface for use in electronic system, has nanowire array that is mounted between metal layers and is composed of multiple of nanowires each has graphene coating, and layer of solder is mounted on outer surface of metal layer.
  • 专利号:   US2021080200-A1, US11493288-B2
  • 发明人:   SHEN S, GONG W, LI P, JING L
  • 专利权人:   UNIV CARNEGIE MELLON
  • 国际专利分类:   F28F013/18, B82Y030/00, B82Y040/00
  • 专利详细信息:   US2021080200-A1 18 Mar 2021 F28F-013/18 202126 English
  • 申请详细信息:   US2021080200-A1 US106608 30 Nov 2020
  • 优先权号:   US763297P, US106608

▎ 摘  要

NOVELTY - The interface has a nanowire array is mounted between a first metal layer and a second metal layer. The nanowire array is composed of multiple of nanowires. Each nanowire has a graphene coating. A first layer of solder is mounted on an outer surface of the first metal layer opposite the nanowires. A second layer of solder is mounted on an outer surface of the second metal layer opposite the nanowires. The first metal layer, the second metal layer and the nanowires are composed of copper. The graphene coating on each nanowire extends approximately 30 ~mm from the surface of the nanowire. USE - Thermal interface for use in electronic system. ADVANTAGE - (1) The overall thermal resistance across interfaces is minimized. (2) The thermal performance of the device is improved. (3) The graphene coating improves the thermal performance of the nano wire array without comprising its physical properties. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) method for creating a thermal interface; and (2) method for bonding the thermal interface. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the thermal interface . Nanoporous template (802) Metal layer (810) Solder layer (812)