▎ 摘　　要

NOVELTY - The method involves providing (S110) a photosensitive glass substrate. The photosensitive glass substrate includes multiple portions to be formed holes. The portion of the photosensitive glass substrate to be formed is exposed (S120) into a hole. The photosensitive glass substrate is subjected (S130) to high temperature tempering treatment at 500 to 600 degrees Celsius. An etching solution for etching treatment is provided (S140) to remove the portion to be formed into a hole to form multiple longitudinal through holes with capillary force. The through holes penetrate the photosensitive glass substrate. A heat generating layer is provided (S150) on the surface of the photosensitive glass substrate. USE - Method for manufacturing heating element. ADVANTAGE - The method enables forming multiple through holes with capillary force on the photosensitive glass substrate, so that the pore rate of the formed heating housing is accurately controlled, thus improving consistency of a product. DESCRIPTION OF DRAWING(S) - The drawing shows a flowchart illustrating a method of manufacturing a heating element. (Drawing includes non-English language text) Step for providing a photosensitive glass substrate (S110) Step for exposing the portion of the photosensitive glass substrate to be formed into a hole (S120) Step for subjecting the photosensitive glass substrate to high temperature tempering treatment at 500 to 600 degrees Celsius (S130) Step for providing the etching solution for etching treatment to remove the portion to be formed into a hole to form multiple longitudinal through holes with capillary force (S140) Step for providing a heat generating layer on the surface of the photosensitive glass substrate (S150)