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  2. 国际专利信息
  • 专利标题:   Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.
  • 专利号:   CN112760644-A, CN214218863-U
  • 发明人:   LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E
  • 专利权人:   SONGSHAN LAKE MATERIALS LAB
  • 国际专利分类:   C22F001/02, C22F001/08, C23C016/02, C23C016/26, C23C028/00, C25D003/38, H01L023/367, H01L023/373
  • 专利详细信息:   CN112760644-A 07 May 2021 C23C-028/00 202145 Pages: 8 Chinese
  • 申请详细信息:   CN112760644-A CN10017035 06 Jan 2021
  • 优先权号:   CN10017035, CN20031952

▎ 摘　　要

NOVELTY - Board comprises a first copper foil, a graphene layer and a second copper foil laminated in order. The first copper foil has a crystal domain number of less than or equal to 5 per square centimeter. The second copper foil is electroplated copper. USE - Used as board. ADVANTAGE - The board has good thermal conductivity coefficient and proper intensity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) preparing board; and (2) a heat equalizing plate. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the board