▎ 摘　　要

NOVELTY - High-precision thin-film chip resistor comprises base body (1), and a resistor set on base body. The resistor body (2) is set on one surface. Electrodes (3) arranged on both sides of the substrate and conducting through resistor body. The outer surface of the resistor body is covered with a glass protective layer (4). The electrode is composed of a palladium-silver electrode layer (31), a nickel barrier layer (32) and a tin-lead solderable layer (33). The palladium-silver electrode layer includes 40-60 wt.% silver powder, 5-10 wt.% palladium powder, 20-40 wt.% nano graphene modified bismuthite powder, 4-5 wt.% lead-free glass powder, and 10-15 wt.% organic carrier. The organic vehicle includes 20-40 wt.% ethyl cellulose, 20-40 wt.% terpineol, 20-25 wt.% butyl carbitol and 15-20 wt.% butyl carbitol acetate. The lead-free glass powder includes 50-80 wt.% bismuth oxide, 10-20 wt.% boron trioxide, 7-20 wt.% silicon dioxide, and 3-10 wt.% aluminum oxide. USE - The resistor is useful in automobile, electronic communication, aerospace, aviation, and medical device device fields. ADVANTAGE - The method enhances its agglomeration adhesion and self-conductivity, which contributes to the uniform and dense combination with the conductive phase, achieves a high proportion of incorporation, significantly improves the anti-sulfurization performance of the palladium-silver motor layer, and improves the corrosion resistance effect to adapt to the high-sulfur concentration environment of the automobile. DESCRIPTION OF DRAWING(S) - The diagram shows a vertical cross-sectional view of the high-precision thin-film chip resistor for automobiles. 1Base body 2Resistor body 3Electrode 4Glass protective layer 31Palladium-silver electrode layer 32Nickel barrier layer 33Tin-lead solderable layer