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  • 专利标题:   Heat dissipation material used in light emitting diode lamp, comprises gallium phosphide, silicon boride, coupling agent, aluminum silicate fiber, copper doped graphene, copper-doped nano-diamond powder, and fluorosilicone resin.
  • 专利号:   CN107674432-A
  • 发明人:  
  • 专利权人:   GUIZHOU MIGUO CREATIVE TECHNOLOGY CO LTD
  • 国际专利分类:   C08K013/06, C08K003/04, C08K003/32, C08K003/38, C08K007/06, C08K009/02, C08K009/04, C08K009/06, C08L083/08
  • 专利详细信息:   CN107674432-A 09 Feb 2018 C08L-083/08 201820 Chinese
  • 申请详细信息:   CN107674432-A CN10964374 17 Oct 2017
  • 优先权号:   CN10964374

▎ 摘　　要

NOVELTY - Heat dissipation material comprises 10-15 pts. wt. gallium phosphide, 10-15 pts. wt. silicon boride, 3-5 pts. wt. coupling agent, 10-15 pts. wt. aluminum silicate fiber, 10-15 pts. wt. copper doped graphene, 10-15 pts. wt. copper-doped nano-diamond powder, and 100 pts. wt. fluorosilicone resin. USE - Heat dissipation material used in light emitting diode lamp (claimed). ADVANTAGE - The heat dissipation material has high thermal conductivity, low expansion characteristics, high heat dissipation capacity for the environment, and stable characteristics.