▎ 摘　　要

NOVELTY - Light-emitting diode (LED) chip with vertical structure comprises a bonding layer located on the first surface of the first substrate and stacked in turn from bottom to top, a reflector layer, a first ohmic contact and an epitaxial layer. The transparent conductive layer and metal nano wire layer located on the surface of the intrinsic semiconductor layer and side wall and the bottom of the through hole. USE - The light-emitting diode chip with vertical structure is used in semiconductor device, LED light emitting device, LED lighting device, LED backlight device and LED display device. ADVANTAGE - The chip has good current expansion and uniform injection effect, and has better light extraction effect. The method is simple, and reduces process complexity. The reflector layer and bonding layer has good thermal-conducting ability, reduces thermal resistance of LED chip of vertical structure, and improves technique yield and reliability. The transparent conductive layer in the through hole has the function of uniformly injecting current to the first semiconductor layer, and improves current distribution and expansion performance of the light emitting surface of the chip. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for manufacturing light-emitting diode chip with vertical structure. DESCRIPTION OF DRAWING(S) - The drawing shows a flow chart illustrating the method for manufacturing light-emitting diode chip with vertical structure (Drawing includes non-English language text).