▎ 摘　　要

NOVELTY - A heat sink (1) consists of components having sub-portion (3) and main portion (2). The sub-portion is mounted on the upper surface of the main portion, and the heat is generated in the upper surface of the sub-portion. A several graphene sheets are connected mutually and arranged in a main surface of the heat sink, which changes the sequence direction of the main portion into a direction parallel to the upper surface and sequence direction of the sub-portion into thickness direction. USE - Heat sink is used for package used for semiconductor device (all claimed). ADVANTAGE - The heat sink has excellent heat dissipating property and intensity. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) package, which consists of a frame. The frame surrounds a region having the components, which generates the heat in the heat sink; and (2) semiconductor device, which consists of the package and a semiconductor element mounted in the region. DESCRIPTION OF DRAWING(S) - The drawing shows the cross-sectional view of the heat sink. Heat sink (1) Main portion (2) Sub-portion (3)